- Fabricant：
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- Bergquist (2)
- Product Status：
-
- Color：
-
- Shape：
-
- Thermal Conductivity：
-
- Outline：
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- Backing, Carrier：
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46 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
Laird Technologies - Thermal Materials | TFLEX HD3200 GAP FI... |
1 |
1
In-stock
|
Obtenir un devis | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
Obtenir un devis |
