- Fabricant：
-
- CUI Devices (1)
- Product Status：
-
- Type：
-
- Attachment Method：
-
- Package Cooled：
-
- Fin Height：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
2 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions Inc. | HEAT SINK 58MM X 30... |
1 |
67
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEATSINK HALF BR... |
1 |
50,000
In-stock
|
Obtenir un devis |
