- Fabricant：
-
- iBASE Technology (1)
- Product Status：
-
- Material：
-
- Type：
-
- Attachment Method：
-
- Package Cooled：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
3 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-3 BLA... |
1 |
825
In-stock
|
Obtenir un devis | ||
|
|
iBASE Technology | HSIBR115-A (HEATSI... |
1 |
1
In-stock
|
Obtenir un devis | ||
|
|
Sanyo Denki America Inc. | P3, 800MHZ, FC-PGA |
1 |
50,000
In-stock
|
Obtenir un devis |
