- Fabricant：
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- CUI Devices (2)
- Attachment Method：
-
- Package Cooled：
-
- Fin Height：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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12 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1 |
1,771
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1 |
1,535
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1 |
1,768
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1 |
1,544
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1 |
1,574
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | HEATSINK CPU XCU... |
1 |
6,151
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1 |
1,143
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1 |
784
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1 |
1,538
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA,25 X... |
1 |
1,440
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1 |
1,857
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 25 ... |
1 |
432
In-stock
|
Obtenir un devis |
