- Fabricant：
-
- CUI Devices (3)
- Wakefield-Vette (2)
- Type：
-
- Attachment Method：
-
- Package Cooled：
-
- Fin Height：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
11 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield-Vette | ANCHOR HEATSINK ... |
1 |
37
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1 |
998
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1 |
1,540
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | HEATSINK CPU STA... |
1 |
2,205
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | HEATSINK CPU STA... |
1 |
2,267
In-stock
|
Obtenir un devis | ||
|
|
Wakefield-Vette | ANCHOR HEATSINK ... |
1 |
191
In-stock
|
Obtenir un devis | ||
|
|
Seeed Technology Co., Ltd | ALUMINUM ALLOY C... |
1 |
11
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | HEATSINK CPU W/AD... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | HEATSINK CPU W/AD... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
Seeed Technology Co., Ltd | ALUMINUM ALLOY C... |
1 |
16
In-stock
|
Obtenir un devis |
