- Fabricant：
-
- CUI Devices (3)
- Type：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
7 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | HEATSINK CPU STA... |
1 |
2,249
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | HEATSINK CPU STA... |
1 |
2,249
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | HEATSINK CPU W/AD... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | HEATSINK CPU W/AD... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
68
In-stock
|
Obtenir un devis |
