- Fabricant：
-
- CUI Devices (6)
- Ohmite (8)
- Wakefield-Vette (2)
- Width：
-
- Attachment Method：
-
- Package Cooled：
-
- Fin Height：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
16 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
1,118
In-stock
|
Obtenir un devis | ||
|
|
Wakefield-Vette | FANSINK 5VDC 50X50X... |
1 |
29
In-stock
|
Obtenir un devis | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
38
In-stock
|
Obtenir un devis | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
5
In-stock
|
Obtenir un devis | ||
|
|
Wakefield-Vette | FANSINK 5VDC 50X50X... |
1 |
5
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
108
In-stock
|
Obtenir un devis | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
103
In-stock
|
Obtenir un devis | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
75
In-stock
|
Obtenir un devis | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
96
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
68
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtenir un devis |
