- Fabricant：
-
- CUI Devices (2)
- Ohmite (8)
- Width：
-
- Attachment Method：
-
- Package Cooled：
-
- Fin Height：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
10 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
1,050
In-stock
|
Obtenir un devis | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
80
In-stock
|
Obtenir un devis | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
22
In-stock
|
Obtenir un devis | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
646
In-stock
|
Obtenir un devis | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
97
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
50,000
In-stock
|
Obtenir un devis |
