- Fabricant：
-
- CUI Devices (3)
- Wakefield-Vette (4)
- Type：
-
- Attachment Method：
-
- Package Cooled：
-
- Fin Height：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
-
- Material Finish：
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12 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield-Vette | ANCHOR HEATSINK ... |
1 |
839
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | CPU HEATSINK, CRO... |
1 |
1,380
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | CPU HEATSINK, CRO... |
1 |
1,500
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | CPU HEATSINK, CRO... |
1 |
1,459
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 35 ... |
1 |
1,166
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | HEATSINK CPU STA... |
1 |
5,233
In-stock
|
Obtenir un devis | ||
|
|
Wakefield-Vette | ANCHOR HEATSINK ... |
1 |
805
In-stock
|
Obtenir un devis | ||
|
|
Wakefield-Vette | ANCHOR HEATSINK ... |
1 |
754
In-stock
|
Obtenir un devis | ||
|
|
Wakefield-Vette | ANCHOR HEATSINK ... |
1 |
192
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 35 ... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | HEATSINK CPU W/AD... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtenir un devis |
