- Fabricant：
-
- CUI Devices (1)
- Product Status：
-
- Type：
-
- Fin Height：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
2 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
TE Connectivity AMP Connectors | HEATSINK ASSEMBL... |
1 |
25
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 28.... |
1 |
1,728
In-stock
|
Obtenir un devis |
