Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Partie Fabricant La description MOQ Stocker Action
HSE08-505028 CUI Devices
HEAT SINK, EXTRUS...
1
RFQ
50,000
In-stock
Obtenir un devis
HSE09-755028 CUI Devices
HEAT SINK, EXTRUS...
1
RFQ
50,000
In-stock
Obtenir un devis
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