- Fabricant：
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- CUI Devices (2)
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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3 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK CPU XCU... |
1 |
56,661
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 33.... |
1 |
1,280
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 8.5... |
1 |
50,000
In-stock
|
Obtenir un devis |
