- Fabricant：
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- CUI Devices (5)
- Width：
-
- Length：
-
- Attachment Method：
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- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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17 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK CPU XCU... |
1 |
2,491
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 18 ... |
1 |
1,105
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | HEATSINK CPU STA... |
1 |
3,653
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | CPU HEATSINK, CRO... |
1 |
1,733
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | CPU HEATSINK, CRO... |
1 |
1,380
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
4
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA,25 X... |
1 |
1,440
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 28.... |
1 |
1,728
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | HEATSINK CPU STA... |
1 |
5,233
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | HEATSINK CPU STA... |
1 |
2,205
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | HEATSINK CPU STA... |
1 |
2,267
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | CPU HEATSINK, CRO... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | HEATSINK CPU W/AD... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | HEATSINK CPU W/AD... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | HEATSINK CPU W/AD... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | HEATSINK CPU W/AD... |
1 |
50,000
In-stock
|
Obtenir un devis |
