- Fabricant：
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- CUI Devices (4)
- Width：
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- Length：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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9 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK CPU XCU... |
1 |
3,523
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 12 ... |
1 |
2,183
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | CPU HEATSINK, CRO... |
1 |
1,318
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | CPU HEATSINK, CRO... |
1 |
1,500
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | HEATSINK CPU XCU... |
1 |
6,151
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1 |
998
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 25 ... |
1 |
432
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 27 ... |
1 |
373
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | CPU HEATSINK, CRO... |
1 |
50,000
In-stock
|
Obtenir un devis |
