- Fabricant：
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- CUI Devices (1)
- Wakefield-Vette (1)
- Type：
-
- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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2 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 43.... |
1 |
1,155
In-stock
|
Obtenir un devis | ||
|
|
Wakefield-Vette | ANCHOR HEATSINK ... |
1 |
986
In-stock
|
Obtenir un devis |
