- Fabricant：
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- CUI Devices (5)
- Width：
-
- Length：
-
- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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10 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK CPU XCU... |
1 |
3,704
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | HEATSINK CPU XCU... |
1 |
1,509
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | HEATSINK CPU XCU... |
1 |
1,207
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 21 ... |
1 |
1,636
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
1,708
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | CPU HEATSINK, CRO... |
1 |
3,488
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | CPU HEATSINK, CRO... |
1 |
2,619
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 14 ... |
1 |
497
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 27 ... |
1 |
472
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 17 ... |
1 |
50,000
In-stock
|
Obtenir un devis |
