- Attachment Method：
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- Package Cooled：
-
- Fin Height：
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- Thermal Resistance @ Forced Air Flow：
-
2 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 17 ... |
1 |
1,935
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
50,000
In-stock
|
Obtenir un devis |
