- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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2 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK BGA W/AD... |
1 |
755
In-stock
|
Obtenir un devis | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BGA HEAT SINK |
1 |
4,769
In-stock
|
Obtenir un devis |
