- Fabricant：
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- CUI Devices (1)
- Sarnikon (6)
- Material：
-
- Length：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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9 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 17 ... |
1 |
1,935
In-stock
|
Obtenir un devis | ||
|
|
Sarnikon | EXTRUDED HEATSIN... |
1 |
500
In-stock
|
Obtenir un devis | ||
|
|
Sarnikon | EXTRUDED HEATSIN... |
1 |
500
In-stock
|
Obtenir un devis | ||
|
|
Sarnikon | EXTRUDED HEATSIN... |
1 |
500
In-stock
|
Obtenir un devis | ||
|
|
Sarnikon | EXTRUDED HEATSIN... |
1 |
500
In-stock
|
Obtenir un devis | ||
|
|
Sarnikon | EXTRUDED HEATSIN... |
1 |
500
In-stock
|
Obtenir un devis | ||
|
|
Sarnikon | EXTRUDED HEATSIN... |
1 |
500
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
1 |
236
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | HEATSINK ANOD AL... |
1 |
50,000
In-stock
|
Obtenir un devis |
