- Fabricant：
-
- CUI Devices (6)
- WEC (1)
- Attachment Method：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
7 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 2.9W... |
1 |
1,798
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
1 |
502
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
1 |
239
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
1 |
290
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
WEC | HEATSINK TO-220 2.9W... |
1 |
3,707
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
1 |
50,000
In-stock
|
Obtenir un devis |
