- Fabricant：
-
- Ohmite (2)
- Wakefield-Vette (1)
- Product Status：
-
- Material：
-
- Shape：
-
- Width：
-
- Length：
-
- Attachment Method：
-
- Package Cooled：
-
- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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11 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1 |
1,535
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1 |
1,544
In-stock
|
Obtenir un devis | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-3 BLA... |
1 |
825
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1 |
1,143
In-stock
|
Obtenir un devis | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-3 H31.7... |
1 |
559
In-stock
|
Obtenir un devis | ||
|
|
Ohmite | BGA HEATSINK W/TA... |
1 |
8
In-stock
|
Obtenir un devis | ||
|
|
Wakefield-Vette | HEATSINK POWER T... |
1 |
499
In-stock
|
Obtenir un devis | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-3 BLA... |
1 |
273
In-stock
|
Obtenir un devis | ||
|
|
Ohmite | HEATSINK DUAL FO... |
1 |
58
In-stock
|
Obtenir un devis | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Obtenir un devis |
