- Fabricant:
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- 3M (8)
- Bergquist (13)
- Leader Tech Inc. (41)
- Parker Chomerics (23)
- Rathbun (1)
- t-Global Technology (540)
- Wakefield-Vette (21)
- Product Status:
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- Material:
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- Color:
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- Type:
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- Thickness:
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- Thermal Conductivity:
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- Outline:
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- Backing, Carrier:
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- Thermal Resistivity:
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1,019 Dossiers
Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
---|---|---|---|---|---|---|---|
Parker Chomerics | THERM-A-GAP G579 9X... |
1 |
365
In-stock
|
Obtenir un devis | |||
Parker Chomerics | THERM-A-GAP G579 9X... |
1 |
146
In-stock
|
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Parker Chomerics | CHO-THERM T500 8X8" ... |
1 |
36
In-stock
|
Obtenir un devis | |||
Parker Chomerics | CHO-THERM T500 8X8" ... |
1 |
27
In-stock
|
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Parker Chomerics | THERM-A-GAP G579 9X... |
1 |
81
In-stock
|
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Parker Chomerics | CHO-THERM 1671 8X8" |
1 |
94
In-stock
|
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Parker Chomerics | CHO-THERM 1671 8X8" W... |
1 |
65
In-stock
|
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Laird Technologies - Thermal Materials | TFLEX SF10,1.50 229X22... |
1 |
88
In-stock
|
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t-Global Technology | THERM PAD 15MMX15M... |
1 |
2,713
In-stock
|
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t-Global Technology | THERM PAD 12.5MMX12... |
1 |
1,042
In-stock
|
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t-Global Technology | THERM PAD 40MMX40M... |
1 |
1,099
In-stock
|
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Laird Technologies EMI | THERMAL GASKET300... |
1 |
197
In-stock
|
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Laird Technologies EMI | THERMALLY CONDUC... |
1 |
142
In-stock
|
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Laird Technologies EMI | THERMAL GASKET300... |
1 |
149
In-stock
|
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Bergquist | HI FLOW THF 500 |
1 |
24,950
In-stock
|
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Bergquist | SP400-0.009-AC CUT TO... |
1 |
4,700
In-stock
|
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Laird Technologies - Thermal Materials | TFLEX HD82250 32X25MM... |
1 |
1,536
In-stock
|
Obtenir un devis | |||
Laird Technologies EMI | RECSTRSD,ECE072 |
1 |
196
In-stock
|
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Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
16
In-stock
|
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Aavid, Thermal Division of Boyd Corporation | PAD SUPER C128 0.5MM... |
1 |
69
In-stock
|
Obtenir un devis |