Product Status:
Backing, Carrier:
Thermal Resistivity:
Image Partie Fabricant La description MOQ Stocker Action
GP1000SF-0.020-02-0816 Bergquist
THERM PAD 406.4MMX2...
1
RFQ
555
In-stock
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A18183-080 Laird Technologies EMI
COOLZORB-ULTRA,0....
1
RFQ
46
In-stock
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69-11-42334-T725 Parker Chomerics
THERM PAD 14X14MM P...
1
RFQ
762
In-stock
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A15754-02 Laird Technologies - Thermal Materials
TFLEX SF820
1
RFQ
105
In-stock
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GP3004SF-0.010-01-0918 Bergquist
BERGQUIST GAP PA...
1
RFQ
13
In-stock
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GP3004SF-0.023-01-0918 Bergquist
BERGQUIST GAP PA...
1
RFQ
7
In-stock
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GP3004SF-0.016-01-0918 Bergquist
BERGQUIST GAP PA...
1
RFQ
8
In-stock
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A18181-040 Laird Technologies EMI
COOLZORB-ULTRA,0....
1
RFQ
5
In-stock
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A18183-040 Laird Technologies EMI
COOLZORB-ULTRA,0....
1
RFQ
5
In-stock
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GP3004SF-0.060-01-0918 Bergquist
BERGQUIST GAP PA...
1
RFQ
2
In-stock
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AF500-153005 CUI Devices
THERM PAD 15MMX30M...
1
RFQ
14
In-stock
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AF500-202005 CUI Devices
THERM PAD 20MMX20M...
1
RFQ
13
In-stock
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AF500-101005 CUI Devices
THERM PAD 10MMX10M...
1
RFQ
11
In-stock
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AF500-505005 CUI Devices
THERM PAD 50MMX50M...
1
RFQ
13
In-stock
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AF500-404005 CUI Devices
THERM PAD 40MMX40M...
1
RFQ
29
In-stock
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AF500-414505 CUI Devices
THERM PAD 41.25MMX4...
1
RFQ
7
In-stock
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AF500-151505 CUI Devices
THERM PAD 15MMX15M...
1
RFQ
24
In-stock
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AF500-303005 CUI Devices
THERM PAD 30MMX30M...
1
RFQ
15
In-stock
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A15754-05 Laird Technologies - Thermal Materials
TFLEX SF850
1
RFQ
2
In-stock
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A15754-06 Laird Technologies - Thermal Materials
TFLEX SF860
1
RFQ
8
In-stock
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