- Fabricant:
-
- Bergquist (9)
- CUI Devices (39)
- Parker Chomerics (3)
- Wakefield-Vette (1)
- Product Status:
-
- Type:
-
- Shape:
-
- Thickness:
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- Usage:
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- Thermal Conductivity:
-
- Outline:
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- Backing, Carrier:
-
- Thermal Resistivity:
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194 Dossiers
Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
---|---|---|---|---|---|---|---|
Bergquist | THERM PAD 406.4MMX2... |
1 |
555
In-stock
|
Obtenir un devis | |||
Laird Technologies EMI | COOLZORB-ULTRA,0.... |
1 |
46
In-stock
|
Obtenir un devis | |||
Parker Chomerics | THERM PAD 14X14MM P... |
1 |
762
In-stock
|
Obtenir un devis | |||
Laird Technologies - Thermal Materials | TFLEX SF820 |
1 |
105
In-stock
|
Obtenir un devis | |||
Bergquist | BERGQUIST GAP PA... |
1 |
13
In-stock
|
Obtenir un devis | |||
Bergquist | BERGQUIST GAP PA... |
1 |
7
In-stock
|
Obtenir un devis | |||
Bergquist | BERGQUIST GAP PA... |
1 |
8
In-stock
|
Obtenir un devis | |||
Laird Technologies EMI | COOLZORB-ULTRA,0.... |
1 |
5
In-stock
|
Obtenir un devis | |||
Laird Technologies EMI | COOLZORB-ULTRA,0.... |
1 |
5
In-stock
|
Obtenir un devis | |||
Bergquist | BERGQUIST GAP PA... |
1 |
2
In-stock
|
Obtenir un devis | |||
CUI Devices | THERM PAD 15MMX30M... |
1 |
14
In-stock
|
Obtenir un devis | |||
CUI Devices | THERM PAD 20MMX20M... |
1 |
13
In-stock
|
Obtenir un devis | |||
CUI Devices | THERM PAD 10MMX10M... |
1 |
11
In-stock
|
Obtenir un devis | |||
CUI Devices | THERM PAD 50MMX50M... |
1 |
13
In-stock
|
Obtenir un devis | |||
CUI Devices | THERM PAD 40MMX40M... |
1 |
29
In-stock
|
Obtenir un devis | |||
CUI Devices | THERM PAD 41.25MMX4... |
1 |
7
In-stock
|
Obtenir un devis | |||
CUI Devices | THERM PAD 15MMX15M... |
1 |
24
In-stock
|
Obtenir un devis | |||
CUI Devices | THERM PAD 30MMX30M... |
1 |
15
In-stock
|
Obtenir un devis | |||
Laird Technologies - Thermal Materials | TFLEX SF850 |
1 |
2
In-stock
|
Obtenir un devis | |||
Laird Technologies - Thermal Materials | TFLEX SF860 |
1 |
8
In-stock
|
Obtenir un devis |