- Fabricant：
-
- Bergquist (1)
- Leader Tech Inc. (1)
- Material：
-
- Shape：
-
- Thermal Conductivity：
-
- Outline：
-
- Backing, Carrier：
-
- Thermal Resistivity：
-
7 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
Bergquist | THERM PAD 406.4MMX2... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
Leader Tech Inc. | THERM PAD 199.9MMX1... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
t-Global Technology | L37-3 SHEET |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
Laird Technologies - Thermal Materials | TFLEX P120 |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
Laird Technologies - Thermal Materials | TFLEX P120 |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
t-Global Technology | TG-A3500 310X310X0.5MM |
1 |
10
In-stock
|
Obtenir un devis |
