- Fabricant:
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- Würth Elektronik (6)
- t-Global Technology (36)
- Product Status:
-
- Material:
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- Shape:
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- Thermal Conductivity:
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- Outline:
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- Backing, Carrier:
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57 Dossiers
Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
---|---|---|---|---|---|---|---|
t-Global Technology | THERMAL PAD 25X25M... |
1 |
141
In-stock
|
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t-Global Technology | THERMAL PAD 30X30M... |
1 |
185
In-stock
|
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t-Global Technology | THERM PAD A4500 15X1... |
1 |
745
In-stock
|
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t-Global Technology | THERM PAD A4500 20X2... |
1 |
223
In-stock
|
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t-Global Technology | THERMAL PAD 10X10M... |
1 |
384
In-stock
|
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t-Global Technology | THERMAL PAD 40X40M... |
1 |
28
In-stock
|
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t-Global Technology | THERMAL PAD 5X5MM... |
1 |
3,611
In-stock
|
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t-Global Technology | THERMAL PAD 15X15M... |
1 |
618
In-stock
|
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t-Global Technology | THERMAL PAD 20X20M... |
1 |
240
In-stock
|
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t-Global Technology | THERM PAD A4500 5X5X... |
1 |
894
In-stock
|
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t-Global Technology | THERM PAD A4500 10X1... |
1 |
68
In-stock
|
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t-Global Technology | THERMAL PAD 310X310... |
1 |
3
In-stock
|
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Würth Elektronik | WE-TGF THERMAL GA... |
1 |
5
In-stock
|
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t-Global Technology | THERMAL PAD 310X310... |
1 |
3
In-stock
|
Obtenir un devis | |||
t-Global Technology | THERMAL PAD 100X100... |
1 |
7
In-stock
|
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t-Global Technology | THERMAL PAD 310X310... |
1 |
2
In-stock
|
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Laird Technologies - Thermal Materials | TFLEX HP34,5.00 127X76... |
1 |
8
In-stock
|
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Würth Elektronik | WE-TGF THERMAL GA... |
1 |
4
In-stock
|
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t-Global Technology | SILICONE THERMAL... |
1 |
1
In-stock
|
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t-Global Technology | THERMAL PAD 100X100... |
1 |
3
In-stock
|
Obtenir un devis |