- Fabricant：
-
- Würth Elektronik (2)
- t-Global Technology (70)
- Product Status：
-
- Material：
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- Type：
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- Shape：
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- Thermal Conductivity：
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- Outline：
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- Backing, Carrier：
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88 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
t-Global Technology | THERM PAD 19.5MMX12... |
1 |
100
In-stock
|
Obtenir un devis | ||
|
|
t-Global Technology | THERM PAD 25MMX25M... |
1 |
40
In-stock
|
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|
|
t-Global Technology | THERM PAD 30MMX30M... |
1 |
83
In-stock
|
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|
|
t-Global Technology | THERM PAD 5MMX5MM... |
1 |
1,355
In-stock
|
Obtenir un devis | ||
|
|
t-Global Technology | THERM PAD 320MMX320... |
1 |
2
In-stock
|
Obtenir un devis | ||
|
|
t-Global Technology | THERMAL PAD 385X285... |
1 |
9
In-stock
|
Obtenir un devis | ||
|
|
t-Global Technology | THERMAL PAD 385X285... |
1 |
10
In-stock
|
Obtenir un devis | ||
|
|
t-Global Technology | THERM PAD 150MMX150... |
1 |
54
In-stock
|
Obtenir un devis | ||
|
|
t-Global Technology | HIGH PERFORMANCE... |
1 |
12
In-stock
|
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|
|
t-Global Technology | THERM PAD 20MMX5MM... |
1 |
5
In-stock
|
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|
|
t-Global Technology | THERM PAD 150MMX150... |
1 |
8
In-stock
|
Obtenir un devis | ||
|
|
t-Global Technology | THERMAL PAD 310X310... |
1 |
2
In-stock
|
Obtenir un devis | ||
|
|
Laird Technologies - Thermal Materials | TFLEX HP34,5.00 127X76... |
1 |
8
In-stock
|
Obtenir un devis | ||
|
|
t-Global Technology | NON-SILICONE THE... |
1 |
2
In-stock
|
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|
|
t-Global Technology | THERM PAD 150MMX150... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
t-Global Technology | THERMAL PAD 310X310... |
1 |
2
In-stock
|
Obtenir un devis | ||
|
|
t-Global Technology | THERMAL PAD 310X310... |
1 |
2
In-stock
|
Obtenir un devis | ||
|
|
t-Global Technology | THERM PAD 150MMX150... |
1 |
17
In-stock
|
Obtenir un devis | ||
|
|
t-Global Technology | THERM PAD 150MMX150... |
1 |
14
In-stock
|
Obtenir un devis | ||
|
|
t-Global Technology | THERM PAD 150MMX150... |
1 |
10
In-stock
|
Obtenir un devis |
