- Thermal Conductivity：
-
- Backing, Carrier：
-
2 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
Laird Technologies - Thermal Materials | THERM PAD 406.4MMX4... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 406.4MMX4... |
1 |
50,000
In-stock
|
Obtenir un devis |
