- Fabricant:
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- t-Global Technology (21)
- Shape:
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- Usage:
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- Thermal Conductivity:
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- Outline:
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- Backing, Carrier:
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22 Dossiers
Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
---|---|---|---|---|---|---|---|
t-Global Technology | THERM PAD 288MMX192... |
1 |
20
In-stock
|
Obtenir un devis | |||
t-Global Technology | THERMAL PAD 160X160... |
1 |
5
In-stock
|
Obtenir un devis | |||
t-Global Technology | THERMAL PAD 160X160... |
1 |
25
In-stock
|
Obtenir un devis | |||
t-Global Technology | THERM PAD 20MMX20M... |
1 |
50,000
In-stock
|
Obtenir un devis | |||
t-Global Technology | NON-SILICONE THE... |
1 |
1
In-stock
|
Obtenir un devis | |||
t-Global Technology | SILICONE THERMAL... |
1 |
50,000
In-stock
|
Obtenir un devis | |||
t-Global Technology | SILICONE THERMAL... |
1 |
50,000
In-stock
|
Obtenir un devis | |||
t-Global Technology | SILICONE THERMAL... |
1 |
50,000
In-stock
|
Obtenir un devis | |||
t-Global Technology | SILICONE THERMAL... |
1 |
50,000
In-stock
|
Obtenir un devis | |||
t-Global Technology | SILICONE THERMAL... |
1 |
50,000
In-stock
|
Obtenir un devis | |||
t-Global Technology | THERMAL PAD 160X160... |
1 |
50,000
In-stock
|
Obtenir un devis | |||
t-Global Technology | SILICONE THERMAL... |
1 |
50,000
In-stock
|
Obtenir un devis | |||
Laird Technologies - Thermal Materials | TFLEX SF10,4.00 457X45... |
1 |
50,000
In-stock
|
Obtenir un devis | |||
t-Global Technology | THERMAL PAD 320X320... |
1 |
50,000
In-stock
|
Obtenir un devis | |||
t-Global Technology | THERMAL PAD 160X160... |
1 |
50,000
In-stock
|
Obtenir un devis | |||
t-Global Technology | THERMAL PAD 320X320... |
1 |
50,000
In-stock
|
Obtenir un devis | |||
t-Global Technology | THERMAL PAD 320X320... |
1 |
50,000
In-stock
|
Obtenir un devis | |||
t-Global Technology | THERMAL PAD 20X20M... |
1 |
50,000
In-stock
|
Obtenir un devis | |||
t-Global Technology | PC96 230X230X4MM 2.5W/M... |
1 |
50,000
In-stock
|
Obtenir un devis | |||
t-Global Technology | THERM PAD 288MMX192... |
1 |
50,000
In-stock
|
Obtenir un devis |