- Fabricant：
-
- Würth Elektronik (1)
- Bergquist (1)
- Parker Chomerics (3)
- Material：
-
- Usage：
-
- Adhesive：
-
- Backing, Carrier：
-
- Thermal Resistivity：
-
5 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
Bergquist | THERM PAD 19.05MMX1... |
1 |
4,479
In-stock
|
Obtenir un devis | ||
|
|
Parker Chomerics | CHO-THERM 1674 TO-22... |
1 |
1,451
In-stock
|
Obtenir un devis | ||
|
|
Parker Chomerics | CHO-THERM 1674 TO-22... |
1 |
901
In-stock
|
Obtenir un devis | ||
|
|
Würth Elektronik | WE-TGF THERMAL GA... |
1 |
21
In-stock
|
Obtenir un devis | ||
|
|
Parker Chomerics | CHO-THERM 1674 0.010" ... |
1 |
31
In-stock
|
Obtenir un devis |
