08-2503-21

N° de pièce du fabricant
08-2503-21
Fabricant
Aries Electronics
Paquet/Cas
-
Fiche de données
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La description
CONN IC DIP SOCKET 8POS GOLD
Stocker:
En stock

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Fabricant :
Aries Electronics
catégorie de produit :
Supports pour circuits intégrés, transistors
Contact Finish - Mating :
Gold
Contact Finish - Post :
Gold
Contact Finish Thickness - Mating :
10.0µin (0.25µm)
Contact Finish Thickness - Post :
10.0µin (0.25µm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Phosphor Bronze
Features :
Closed Frame
Housing Material :
Polyamide (PA46), Nylon 4/6, Glass Filled
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
8 (2 x 4)
Operating Temperature :
-55°C ~ 125°C
Pitch - Mating :
0.100" (2.54mm)
Pitch - Post :
0.100" (2.54mm)
Product Status :
Active
Termination :
Wire Wrap
Type :
DIP, 0.2" (5.08mm) Row Spacing
Feuilles de données
08-2503-21

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