- Fabricant：
-
- CUI Devices (4)
- iWave Systems (2)
- WEC (1)
- Material：
-
- Length：
-
- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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14 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions Inc. | SUPERGRIP HEATSI... |
1 |
99
In-stock
|
Obtenir un devis | ||
|
|
Advanced Thermal Solutions Inc. | SUPERGRIP HEATSI... |
1 |
34
In-stock
|
Obtenir un devis | ||
|
|
iWave Systems | I.MX 8QM SMARC SOM... |
1 |
10
In-stock
|
Obtenir un devis | ||
|
|
iWave Systems | I.MX 8M SMARC SOM ... |
1 |
10
In-stock
|
Obtenir un devis | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 42MM X 42... |
1 |
27
In-stock
|
Obtenir un devis | ||
|
|
Advanced Thermal Solutions Inc. | SUPERGRIP HEATSI... |
1 |
116
In-stock
|
Obtenir un devis | ||
|
|
Advanced Thermal Solutions Inc. | SUPERGRIP HEATSI... |
1 |
101
In-stock
|
Obtenir un devis | ||
|
|
Advanced Thermal Solutions Inc. | SUPERGRIP HEATSI... |
1 |
185
In-stock
|
Obtenir un devis | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 42MM X 42... |
1 |
76
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
WEC | HEAT SINK, EXTRUS... |
1 |
568
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtenir un devis |
