- Fabricant：
-
- CUI Devices (10)
- WEC (3)
- Width：
-
- Attachment Method：
-
- Package Cooled：
-
- Fin Height：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
15 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
NTE Electronics, Inc | HEAT SINK PLAST.P... |
1 |
256
In-stock
|
Obtenir un devis | ||
|
|
NTE Electronics, Inc | HEAT SINK FOR TO2... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
1,492
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
710
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
610
In-stock
|
Obtenir un devis | ||
|
|
WEC | HEAT SINK, EXTRUS... |
1 |
568
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
WEC | HEAT SINK, EXTRUS... |
1 |
930
In-stock
|
Obtenir un devis | ||
|
|
WEC | HEAT SINK, EXTRUS... |
1 |
701
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtenir un devis |
