- Attachment Method：
-
- Package Cooled：
-
- Fin Height：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
3 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
50,000
In-stock
|
Obtenir un devis |
