- Fabricant：
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- CUI Devices (26)
- Width：
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- Length：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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27 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 21 ... |
1 |
1,636
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 12 ... |
1 |
2,183
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 18 ... |
1 |
1,105
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
1,708
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 10 ... |
1 |
3,170
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 21 ... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
4
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 17 ... |
1 |
1,935
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 35 ... |
1 |
1,166
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 45 ... |
1 |
803
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1 |
998
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1 |
1,540
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA,25 X... |
1 |
1,440
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 33.... |
1 |
1,280
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
1,408
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 43.... |
1 |
1,155
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 14 ... |
1 |
497
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 27 ... |
1 |
472
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 30.... |
1 |
532
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 25 ... |
1 |
432
In-stock
|
Obtenir un devis |
