- Fabricant：
-
- CUI Devices (4)
- Ohmite (1)
- Type：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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6 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
21,545
In-stock
|
Obtenir un devis | ||
|
|
Ohmite | BGA HEATSINK W/TA... |
1 |
487
In-stock
|
Obtenir un devis | ||
|
|
Assmann WSW Components | CPU HEATSINK, CRO... |
1 |
1,500
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, BGA, 20 ... |
1 |
50,000
In-stock
|
Obtenir un devis |
