- Fabricant：
-
- Material：
-
- Length：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
6 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions Inc. | HEATSINK AL6063 1220... |
1 |
25
In-stock
|
Obtenir un devis | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK AL6063 300X... |
1 |
2,874
In-stock
|
Obtenir un devis | ||
|
|
Aavid, Thermal Division of Boyd Corporation | COPPER HEATSINK ... |
1 |
94
In-stock
|
Obtenir un devis | ||
|
|
NTE Electronics, Inc | HEAT SINK-TO-5 TRA... |
1 |
17
In-stock
|
Obtenir un devis | ||
|
|
TE Connectivity AMP Connectors | GANGED QSFP LAN E... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Obtenir un devis |
