- Fabricant：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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4 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions Inc. | HEATSINK AL6063 1220... |
1 |
25
In-stock
|
Obtenir un devis | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK AL6063 300X... |
1 |
2,874
In-stock
|
Obtenir un devis | ||
|
|
TE Connectivity AMP Connectors | GANGED QSFP LAN E... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Obtenir un devis |
