- Fabricant：
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- CUI Devices (1)
- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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6 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions Inc. | HEAT SINK 42.5 X 42.5... |
1 |
37
In-stock
|
Obtenir un devis | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 19MM X 19... |
1 |
90
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 45MM X 45... |
1 |
21
In-stock
|
Obtenir un devis | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK 42.5X42.5X9... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK 45X45X9.5M... |
1 |
50,000
In-stock
|
Obtenir un devis |
