- Fabricant：
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- CUI Devices (2)
- Product Status：
-
- Material：
-
- Type：
-
- Diameter：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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7 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
TE Connectivity AMP Connectors | 27MM HS ASSY ULTEM... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
CUI Devices | HEATSINK TO-220 6.5W... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
TE Connectivity AMP Connectors | 37.5MM HS ASSY ULTE... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
TE Connectivity AMP Connectors | 35MM HS ASSY ULTEM... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
TE Connectivity AMP Connectors | 29MM HS ASSY ULTEM... |
1 |
50,000
In-stock
|
Obtenir un devis | ||
|
|
TE Connectivity AMP Connectors | 27MM HS ASSY ULTEM... |
1 |
50,000
In-stock
|
Obtenir un devis |
