Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Image Partie Fabricant La description MOQ Stocker Action
HSE-B20630-040H CUI Devices
HEAT SINK, EXTRUS...
1
RFQ
50,000
In-stock
Obtenir un devis
HSS-B20-NP-04 CUI Devices
HEATSINK TO-220 6.5W...
1
RFQ
50,000
In-stock
Obtenir un devis
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