- Fabricant：
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- Würth Elektronik (2)
- Jones Tech (4)
- t-Global Technology (114)
- Product Status：
-
- Material：
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- Type：
-
- Thermal Conductivity：
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- Outline：
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- Backing, Carrier：
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148 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
t-Global Technology | THERMAL PAD 385X285... |
1 |
10
In-stock
|
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t-Global Technology | THERMAL PAD 385X285... |
1 |
10
In-stock
|
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|
t-Global Technology | THERMAL PAD 385X285... |
1 |
10
In-stock
|
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|
|
t-Global Technology | SILICONE THERMAL... |
1 |
53
In-stock
|
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|
|
t-Global Technology | THERM PAD A4500 5X5X... |
1 |
370
In-stock
|
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|
|
t-Global Technology | THERMAL PAD 160X160... |
1 |
5
In-stock
|
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|
t-Global Technology | THERM PAD A6200 5X5X... |
1 |
591
In-stock
|
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|
t-Global Technology | THERM PAD A3500 15X1... |
1 |
103
In-stock
|
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|
|
t-Global Technology | THERM PAD A4500 15X1... |
1 |
92
In-stock
|
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|
|
t-Global Technology | THERMAL PAD 100X100... |
1 |
6
In-stock
|
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t-Global Technology | THERMAL PAD 310X310... |
1 |
2
In-stock
|
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|
|
Laird Technologies - Thermal Materials | TFLEX HP34,4.00 127X76... |
1 |
2
In-stock
|
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|
Würth Elektronik | WE-TGF THERMAL GA... |
1 |
14
In-stock
|
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|
t-Global Technology | THERMAL PAD 310X310... |
1 |
2
In-stock
|
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|
t-Global Technology | NON-SILICONE THE... |
1 |
2
In-stock
|
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t-Global Technology | THERMAL PAD 310X310... |
1 |
2
In-stock
|
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|
|
t-Global Technology | THERM PAD A3500 5X5X... |
1 |
822
In-stock
|
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|
t-Global Technology | THERMAL PAD 190X140... |
1 |
20
In-stock
|
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|
t-Global Technology | THERMAL PAD 190X140... |
1 |
10
In-stock
|
Obtenir un devis | ||
|
|
t-Global Technology | THERMAL PAD 285X190... |
1 |
10
In-stock
|
Obtenir un devis |
