- Width：
-
- Length：
-
- Package Cooled：
-
- Fin Height：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
11 Dossiers
| Image | Partie | Fabricant | La description | MOQ | Stocker | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,908
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|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,909
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|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,219
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|
CUI Devices | HEAT SINK, STAMPI... |
1 |
4,992
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|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,725
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|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,988
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|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,361
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|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,974
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|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
50,000
In-stock
|
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|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
50,000
In-stock
|
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|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
50,000
In-stock
|
Obtenir un devis |
